chip assembly

alpha europe and its partners provide only the highest-quality IC assembly services during manufacturing. Due to our high quality, quick-turn assembly process we help our customers introduce new products to market in the fastest time possible. We assemble ICs in both prototype and production volumes to help qualify designs and to provide high quality samples to customers.

alpha europe understands that time is money, so we pride ourselves in our ability to adapt to customer requirements and delivery times. In fact, it is this adaptive ability that separates us from all other assembly subcontractors worldwide!

Our manufacturing capabilities allow for both black and optical packages with:

  • ultra-fine pitch bonding
  • wide variety of QFN, QFP, SOP, SOT packages
  • BGA with different wire counts, and body sizes
  • custom and module including SIP and multichip assemblies
  • sealing method – dam, fill, transfer mold, open cavity

We here at alpha europe are always looking to the future and continuously invest in new equipment to match individual customer’s needs. This allows all our customers to stay on the forefront of emerging markets and technologies at all times.

Our IC Assembly services include:

  • wafer grinding, thinning and polishing (75mm to 300mm wafer diameters)
  • wafer sawing and dicing ( full wafer, individual dies and MPW wafer)
  • die plating and pick and place
  • die inspection
  • die attach
  • wire bond (aluminum, gold, multi tier)
  • flip chip
  • encapsulation and transfer mold
  • substrate solder ball attach
  • device singulation
  • laser and ink marking
  • packaging in tube, T&R and trays

Together with our certified partners in the microelectronics and automotive sector, we assemble your chips in following standard packages:

 

type technical details
DIP/PDIP 600mil 24/28/40, 400mil 22/24/30, 300mil 8/14/16/2


SOP 300mil 16/20/24/28, 150mil 8/14/20


T/S-SOP SSOP16…28, TSSOP8…28, MSOP8/10, HSOP11/16,VSSOP8


T/L-QFP 5x5-32, 7x7-28…64, 10x10-44…80, 14x14-44…100, 14x20-64…100, 20x20-120


VQFN 6x6-36


QFN/DFN/LGA 1x1 … 15x5mm – 2…256 leads /thickness 0.4, 0.5, 0.6, 0.75, 0.9mm


Power QFN customized sizes and also with Au wire up to 2mil and Cu-clips


SOT/TO/ SC SOT23/25/26/89/143/143R/223/343/353/363/553/563/953/963, TO92, SC59/70


SON SON1408/1612/2017/3044


Power TO3, TO220/F-3/5/7/15, TO 251/2, TO 263-3/5, LDPAK-S/L, DPAK-S/L


Optical „clear“ QFN/DFN/LGA in 2x2 … 7x7mm - 3…56 leads /thickness 0.5 … 0.9mm


RFID special package in 0.4 and 0.33mm thickness


SIP customized sizes  
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  • most packages also available for multi-die and stacked chips
  • standard lead time is in average only 1-2 weeks depending the package, hot lots - on request
  • small volumes available
  • detailed description and drawing of the packages you get on request